Photosensitive resin is a substrate that is laser-cured and rapidly formed, and its performance characteristics have a decisive influence on the quality of the molded part. Photocuring resins using SL should generally have the following properties:
(1) The viscosity is low, and the low-viscosity resin is favorable for the faster leveling of the resin during molding;
(2) The curing speed is fast, and the curing speed of the resin directly affects the molding efficiency, thereby affecting economic benefits;
(3) The curing shrinkage is small, and the photosensitive resin undergoes a change process from liquid to solid during the curing process. This change often causes linear and volume shrinkage of the resin, and the curing shrinkage causes deformation, warpage, cracking, etc. of the part. Therefore, the precision of the molded parts is affected, and the shrinkage of the resin is the main target in the development process of the photosensitive resin, and the low shrinkage resin is favorable for molding the precision parts;
(4) The degree of primary curing is high, which can reduce post-cure shrinkage, thereby reducing post-cure deformation;
(5) The wet strength is high, and the high wet strength can ensure that the post-cure process does not cause deformation, expansion and interlayer peeling;
(6) The swelling is small, and the swelling of the wet molded part in the liquid resin sample piece in the liquid resin causes the part size to be large;
(7) The toxicity is small, which is beneficial to the health of the operator and does not cause environmental pollution.